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News Press Contact – John Whitacre Hifonic’s New HFi Subwoofer Series January 1, 2007 - Chicago, IL., Maxxsonics USA Inc., the parent company of Hifonics, announced today the kick-off of two new Hifonics entry series subwoofers. The HFi Series joins the HF family that was introduced last January 2006. Representing the new Hifonics HFi value subwoofer series are the following configurations…
The all-new Hifonics HFi Series subwoofers represent the best subwoofer value in the Hifonics line up. All HFi models perform well in small sealed and ported enclosures. Recommended sealed and or ported enclosure volumes are as low as 0.5 cubic feet to 0.75 cubic feet for either 12” model. Amongst the new Hifonics HFi subwoofers key features are; Poly-Mica filled injected-molded polypropylene cones, 1-inch butyl rubber surrounds, chrome speaker frames, 4-layer high-temp voice-coils, rugged integrated one-piece spider tinsel lead assemblies, nickel-plated Push & Insert wire terminals, ported nickel-plated motor assembly backplate, and a protective anti-resonant magnet boot. All of the new Hifonics HFi subwoofers were developed using the latest engineering software which identifies potential mechanical weaknesses prior to finalization permitting a more robust product design to result. This FEA driven product development ensures the highest levels of performance available. All Hifonics HFi subwoofers were engineered to provide years of reliable performance even under demanding conditions. Hifonics year 2007 HFi Series subwoofers join over 30 new Hifonics speaker and amplifier products. Initial delivery of these new products will take place in the first quarter of 2007. Maxxsonics USA Inc. Parent Corporation to MB Quart, Hifonics, Crunch, and Autotek sound system brands, has received many CES Innovations Design & Engineering Awards. See all of our products at the www.maxxsonics.com website.
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