New Maxximus 6000-Watt Subwoofer System
Hifonics Transformable Subwoofer System
January 1, 2007 - Chicago, IL. , Maxxsonics USA Inc. the parent company of Hifonics, announced today, the introduction of a unique problem-solving two-part subwoofer system that results in a 6000-Watt Maxximus Subwoofer. Hifonics two-part system of competition-grade Maxximus level subwoofer frames, and a large family of optional drop-in cone-assemblies, joins the ranks of over 30 new amplifier and speaker products being introduced under the Hifonics’ brand at CES2007.
Available in 18-inch, 15-inch, and 12-inch Maxximus subwoofer assembly kits, Hifonics Bass-Frame™ allows permanently mounting this subwoofer concept’s massive cast frame and magnet into an optimum enclosure while permitting the swap-out or replacement of its cone and voice-coil. A typical pit-stop to change a Maxximus subwoofer cone assembly is approximately 3-minutes. Requiring no glue, no soldering or voice-coil alignment devices, swapping out a subwoofer in Hifonics Bass-Frame only involves removing and reinserting 18-screws. Four optional subwoofer cones, available in a variety of dual voice-coil impedances round out each Bass Frame™ design. The 18-inch Bass Frame™ has an MSRP of $1199.00, the 15-inch frame has an MSRP of $1099.00 and the 12-inch Bass Frame™ retails for $999.00 MSRP. Bass Frame™ replacement subwoofer cone kits come pre-aligned in a secondary basket, in a variety of DVC impedances, ranging from .05-Ohms to 1.4-Ohms. Bass Frame™ cone kit assemblies will range in cost from $400.00 to $500 MSRP.
All Hifonics Bass Frame’s key features include; 540oz. triple-stacked high-energy magnet assemblies, competition-grade cast-aluminum framework, ultra-rigid copolymer laminated cones, extra-long excursion butyl-infused triple-layer W-style surrounds, three-layer Conex spider assemblies with six massive integrated tinsel-conductors, and an oversized chrome-plated top and front plates. A system of radial-cut cooling ducts move heat away from the aluminum VC formers and 4-inch DVC flat-wire wound voice-coils. Bass Frame’s radial-cut cooling ducts audibly reduce low-frequency distortions. FEA engineering software was a key element in each subwoofer cone’s design phase in-order tweak the replaceable cones topography for the highest possible SPL readings.
Bass Frame will be first seen during the 2007 CES, in the LVCC North Hall, inside Maxxsonics booth #1822 amongst the displays for Hifonics, Autotek, Crunch and MB Quart audio products. Initial delivery of the Maxx Frame will be in early Spring 2007.
Maxxsonics USA Inc. Parent Corporation to MB Quart, Hifonics, Crunch, and Autotek sound system brands has received many CES Innovations Design & Engineering Awards. See all of our products at the www.maxxsonics.com website.